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data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 1 general description the ap3417b is a 1.4mhz fixed frequency, current mode, pwm synchronous buck (step-down) dc-dc converter, capable of drivin g a 1.2a load with high efficiency, excellent line and load regulation. the device integrates synchronous p-channel and n-channel power mosfet switches with low on-resistance. it is id eal for powering portable equipment that runs from a single li-ion battery. a standard series of indu ctors are available from several different manufacturers optimized for use with the ap3417b. this feat ure greatly simplifies the design of switch-mode power supplies. the ap3417b is ava ilable in sot-23-5 package. features ? input voltage range: 2.5v to 5.5v ? output voltage: 0.6v to v in ? adj output ? fixed 1.4mhz frequency ? high efficiency up to 95% ? output current: 1.2a ? current mode control ? 100% duty cycle in dropout ? built-in over current protection ? built-in short circuit protection ? built-in thermal shutdown protection ? built-in uvlo function ? built-in soft-start ? built-in input over voltage protection (iovp) applications ? set-top box ? datacom ? portable device ? smart phone figure 1. package type of ap3417b sot-23-5
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 2 1 2 34 5 en gnd sw fb vin pin configuration k package (sot-23-5) figure 2. pin configuration of ap3417b (top view) pin description pin number pin name function 1 en control input pin. forcing this pin above 1.5v enables the ic. forcing this pin below 0.4v shuts down the ic. when the ic is in shutdown mode, all functions are disabled to decrease the supply current below 1 a 2 gnd ground pin 3 sw power switch output pin. inductor connection to drain of the internal pfet and nfet switches 4 vin supply input pin. bypass to gnd with a 4.7 f or greater ceramic capacitor 5 fb this is the feedback pin of the device. connect this pin directly to the output if the fixed output voltage version is used. for the adjustable version, an external resistor divider is connected to this pin
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 3 functional block diagram driver figure 3. functional block diagram of ap3417b ordering information ap3417b - g1: green circuit type package temperature range part number marking id packing type sot-23-5 -40 to 85oc AP3417BK-ADJTRG1 g2j tape & reel bcd semiconductor's pb-free products, as designated with "g1" suffix in the part number, are rohs compliant and green. tr: tape & reel k: sot-23-5 adj: adjustable output
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 4 absolute maximum ratings (note 1) parameter symbol value unit input voltage v in -0.3 to 6.0 v feedback voltage v fb -0.3 to v in +0.3 v en pin voltage v en -0.3 to v in +0.3 v sw pin voltage v sw -0.3 to v in +0.3 v thermal resistance ja 265 oc/w operating junction temperature t j 150 oc storage temperature t stg -65 to 150 oc lead temperature (soldering, 10sec) t lead 260 oc esd(machine model) 200 v esd(human body model) 2000 v note 1: stresses greater than those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under ?recommended operating co nditions? is not implied. exposure to ?absolute maximum ratings? for extended periods may affect device reliability. recommended operating conditions parameter symbol min max unit input voltage v in 2.5 5.5 v operating ambient temperature t a -40 85 oc
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 5 electrical characteristics v in =5v, t a =25 oc , unless otherwise specified. parameters symbol condi tions min typ max unit input voltage v in 2.5 5.5 v quiescent current i q v fb =0.65v 62 100 a shutdown supply current i stby v en =gnd 0.1 1 a reference voltage v ref 0.588 0.6 0.612 v feedback bias current i fb_h v fb =1v -0.1 0.1 a i fb_l v fb =0v -0.1 0.1 pmosfet r on r ds(on)_ p i sw =200ma 0.25 ? nmosfet r on r ds(on) _n i sw =-200ma 0.2 ? switch current limit i lim v fb =0.55v 1.5 2.0 a en pin threshold v h 1.5 v v l 0.4 uvlo threshold v uvlo v in rising 2.3 v uvlo hysteresis v hys 0.2 oscillator frequency f osc 1.12 1.40 1.68 mhz max. duty cycle d max 100 % min. duty cycle d min 0 sw leakage current i sw_h v sw =0v 0.1 a i sw_l v sw =5v 0.1 soft-start time t ss 1 ms thermal shutdown t otsd 160 oc thermal shutdown hysteresis t hys 20 oc input ovp threshold v iovp v in rising 6.3 v input ovp hysteresis v iovp_hys 0.5 v
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 6 typical performance characteristics figure 4. efficiency vs. output current figure 5. efficiency vs. output current figure 6. output voltage vs. output current figure 7. frequency vs. input voltage 0.00.20.40.60.81.01.2 50 55 60 65 70 75 80 85 90 95 100 output current (a) efficiency (%) v in =5.0v v out =1.8v 0.01 0.1 1 50 55 60 65 70 75 80 85 90 95 100 output current (a) efficiency (%) v in =5.0v v out =1.8v 0 200 400 600 800 1000 1200 1.73 1.74 1.75 1.76 1.77 1.78 1.79 1.80 1.81 output current (ma) output voltage (v) 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 1.60 1.65 1.70 input voltage (v) frequency (mhz)
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 7 typical performance characteristics (continued) figure 8. frequency vs. temperature figure 9. reference voltage vs. temperature figure 10. switch current limit vs. temperature figure 11. r ds(on)_up vs. temperature -40 -20 0 20 40 60 80 100 120 140 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 temperature ( o c) frequency (mhz) v in =v en =5.0v -40 -20 0 20 40 60 80 100 120 140 0.56 0.57 0.58 0.59 0.60 0.61 0.62 0.63 0.64 temperature ( o c) reference voltage (v) v in =5.0v -40 -20 0 20 40 60 80 100 120 140 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 temperature ( o c) switch current limit (a) v in =5.0v -40 -20 0 20 40 60 80 100 120 140 0.18 0.20 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 temperature ( o c) pmos r ds(on)_up ( ? ) v in =5.0v i sw =200ma
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 8 typical performance characteristics (continued) figure 12. r ds(on)_down vs. temperature figure 13. output ripple (i out =0a) figure 14. output ripple (i out =1.2a) figure 15. load transient (i out =0a to 1.2a) time 4ms/div v out_ac 5mv/div v sw 5v/div i l 100ma / div time 200 s/div v out_ac 200mv/div i out 1a / div v sw 5v/div v out_ac 10mv/div v sw 5v/div i l 1a/div time 400ns/div -40 -20 0 20 40 60 80 100 120 140 0.04 0.08 0.12 0.16 0.20 0.24 0.28 0.32 temperature ( o c) nmos r ds(on)_down ( ? ) v in =5.0v i sw =200ma
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 9 typical performance characteristics (continued) figure 16. enable turn on (i out =1.2a) figure 17. enable turn off (i out =1.2a) figure 18. short circuit protection figure 19. short circuit protection recovery (i out =1.2a) (i out =1.2a) time 200 s/div v en 5v/div v sw 5v/div i l 1a / div time 10ms/div v out 1v/div i l 1a / div v sw 5v/div v out 1v/div v sw 5v/div i l 1a/div time 10ms/div v sw 5v/div v out 1v/div i l 1a/div v en 5v/div time 400 s/div v out 1v/div
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 10 typical performance characteristics (continued) figure 20. over voltage protection figure 21. over voltage protection recovery (i out =1.2a) (i out =1.2a) time 20ms/div v in 5v/div v sw 5v/div i l 1a / div v sw 5v/div v out 1v/div i l 1a/div v in 5v/div time 100ms/div v out 1v/div
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 11 typical application figure 22. typical application of ap3417b
data sheet 1.2a, 1.4mhz high efficiency sync hronous dc-dc buck converter ap3417b jan. 2013 rev. 1. 0 bcd semiconductor manufacturing limited 12 mechanical dimensions sot-23-5 unit: mm(inch) 2.820(0.111) 0 . 0 0 0 ( 0 . 0 0 0 ) 0.300(0.012) 0.950(0.037) 0 . 9 0 0 ( 0 . 0 3 5 ) 0.100(0.004) 0.200(0.008) 8 0 3.020(0.119) 0.400(0.016) 0 . 1 5 0 ( 0 . 0 0 6 ) 1 . 3 0 0 ( 0 . 0 5 1 ) 0.200(0.008) 1.800(0.071) 2.000(0.079) 0 . 7 0 0 ( 0 . 0 2 8 ) r e f t y p
important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing co., ltd. 800 yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd., shenzhen office unit a room 1203, skyworth bldg., gaoxin ave.1.s., nanshan district, shenzhen, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corp. 30920 huntwood ave. hayward, ca 94544, usa tel : +1-510-324-2988 fax: +1-510-324-2788 - headquarters bcd semiconductor manufacturing limited no. 1600, zi xing road, shanghai zizhu sc ience-based industrial park, 200241, china tel: +86-21-24162266, fax: +86-21-24162277 bcd semiconductor manufacturing limited important notice bcd semiconductor manufacturing limited reserves the right to make changes without further not ice to any products or specifi- cations herein. bcd semiconductor manufacturing limited does not as sume any responsibility for us e of any its products for any particular purpose, nor does bcd semiconductor manufacturi ng limited assume any liability aris ing out of the application or use of any its products or circui ts. bcd semiconductor manufacturing limited does not convey any license under its patent rights or other rights nor the rights of others. - wafer fab shanghai sim-bcd semiconductor manufacturing limited 800, yi shan road, shanghai 200233, china tel: +86-21-6485 1491, fax: +86-21-5450 0008 bcd semiconductor manufacturing limited main site regional sales office shenzhen office shanghai sim-bcd semiconductor manuf acturing co., ltd. shenzhen office advanced analog circuits (shanghai) corporation shenzhen office room e, 5f, noble center, no.1006, 3rd fuzhong road, futian district, shenzhen 518026, china tel: +86-755-8826 7951 fax: +86-755-8826 7865 taiwan office bcd semiconductor (taiwan) company limited 4f, 298-1, rui guang road, nei-hu district, taipei, taiwan tel: +886-2-2656 2808 fax: +886-2-2656 2806 usa office bcd semiconductor corporation 30920 huntwood ave. hayward, ca 94544, u.s.a tel : +1-510-324-2988 fax: +1-510-324-2788 - ic design group advanced analog circuits (shanghai) corporation 8f, zone b, 900, yi shan road, shanghai 200233, china tel: +86-21-6495 9539, fax: +86-21-6485 9673 bcd semiconductor manufacturing limited http://www.bcdsemi.com bcd semiconductor manufacturing limited

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